Detailed Product Description

HT-JC-2 Automatic Smart Card Embedding Test Machine is in use for testing different types and standards of chips, then applying glue, die cutting and planting in milled cavities to achieve IC embedding. The machine consists of card transport, card carrier check, chips feed unit, chips test, chips cut, glue applying unit, chips moving unit, hot weld, cold press, testing and card stacker. The machine is controlled by PLC and the operator can change parameters through the touch screen. Card transport uses a configuration of multilevel downward pulling and a blow unit to avoid double card. Machine will automatically stop in the situation of card dropping off from it or being unusual. Once there is no card detected by the photoelectric sensors, it alarms. There are the sensors of testing cavities in the transfer station, when a card carrier has no milled cavity or in wrong put on, the machine automatically stops to wait for handling. Material wheel and hot melt glue wheel both have the functions of automatic feeding and so on. When applying glue on chips of CPU card and SIM card etc., it is necessary to avoid the raised portion of chips to cause gap, the machine has a work point for holing on hot melt glue strip and the holing mould. Once the photosensors spot a holed chip (bad chip), no die cutting any more to avoid having influence on the quality of cutting and welding of the next chip after applying glue on that. The photosensors ensure that chips position are precise, when pulling chips un-accurate, the machine automatically stops to wait for handling, so that prevent from cutting to damage a chip. Two groups of the chips cutting units that are independent each other ensure those bad chips (holed chips) are not cut, but straight jumping over. The advantage is that preventing glue from leaking from the hole of holed chips and stick on the suction nozzle, so influence the quality of followed working procedure. Use two groups of mutually independent servomotors and precision lead screws to achieve the high speed and accurate transferring chips. The front and rear position of embedded chips may directly change parameters on the touch screen to ensure accuracy of moving carrier each time. Heating meanwhile moving chips. Use a unique amending clamp apparatus and upper position structure, not under the influence of card carriers thickness and ensure that the surfaces of implanted chips are smoothness. Both place and height of weld head may be adjusted through fine adjusting unit to assure planeness. Automatically detect the circuits of chips (option: connect to a computer to enter personalized information), automatically separate out the bad chips. When the photosensor detects that card stacker are full, it alarms.

Material Size:54mm*85.6mm

Control Manner:PLC+touch screen

Precision Of Repeat:0.05mm

Precision Of Adjusting:0.01mm

Commpressed Air:0.6MPa

Air Consumption:12liter/min

Production:1200-1600cards/hour

Power Supply:AC220V  50Hz, single phase, 3-wire

Power:1.1KW

Weight:800KG

Dimension:1800mm*900mm*2150mm